With the iPhone 6s and iPhone 6s Plus heading their way to stores this Sept. 25, rumors about the iPhone 7 have begun to emerge. It is likely that the phone will be released in fall 2016, but speculations about its size and specs continue to leak online. In this case it appears the iPhone 7 will utilize an A10 system on a chip (SOC). 

According to a report from Geek.com, Apple has already begun ordering A10 chips from the Taiwan Semiconductor Manufacturing Company and that the company will begin volume production by March of next year. The contract is reportedly exclusive for TSMC.

The A9 chip, introduced in the 6s and 6s Plus to replace the A8 used on the regular iPhone 6 and iPhone 6 Plus, is said to boost processing performance by 70 percent and 80 percent in regard to graphics performance. The A10, a 16nm-sized chip, will then build on that foundation while also introducing new features.

It is also reported that the next iPhone will finally see Apple upgrading the on-board RAM from 1 GB to 2 GB. This has been long overdue as most of the iPhone's competition have increased their RAM capacity long ago.

However, taking things slow is a common aspect with the Apple iPhone. After all, 12 MP rear cameras were introduced as far back as 2013 and it is only with the new iPhone 6s and iPhone 6s Plus that Apple has moved away from the 8 MP camera.

One thing the iPhone 7 will not change is the dimensions of the devices. According to KnowYourMobile, the company has made it clear during the 6s and 6s Plus reveal that the iPhone and future iterations will stick with the 4.7-inch and 5.5-inch designs instead of reverting back to the smaller 4-inch design. 

Seeing that the iPhone 6s introduced iOS 9, it is safe to say that the iPhone 7 will also bring on board iOS 10.