LG G7 ThinQ release date, specs rumors 2018: To boast a loud Boombox Speaker

LG has already confirmed the arrival of its next flagship smartphones, the G7 ThinQ. The South Korean tech firm was expected to launch the LG G6 successor earlier this year, but due to a last-minute design overhaul, the handset will be officially unveiled at a keynote event in New York City on May 2. Per the latest scoop, the LG G7 ThinQ will boast the so-called Boombox Speaker, making it the loudest smartphone in the market by the time of its release.

The LG G6, featuring slimmer bezels and Hi-Fi DACLG website

As reported by Engadget, the Boombox Speaker of the LG G7 ThinQ will make the handset's base sound level increase by more than 6dB. Interestingly, this increase will come with twice the amount of base. The company claims that this increase in base sound level is equivalent to ten times the loudness of a regular smartphone available today.

This is a remarkable feat for a mobile device, given the physical limitations of its parts when subjected to loud sound. In fact, the LG G7 ThinQ's bass output surpasses any other smartphones, including Apple's latest flagship, the iPhone X.

Another highlight of the LG G7 ThinQ's Boombox Speaker is that the bass effect can be further improved by placing the handset on a solid surface, or inside a box. So far, LG has yet to reveal the science behind this feature, although it is noted that the Boombox Speaker uses a special resonance chamber design within the G7 ThinQ to allow the amplification of sound.

With this latest addition to the LG G7 ThinQ features, the upcoming smartphone is slated to be among the biggest flagship offerings of 2018. Aside from the Boombox Speaker, earlier specs leak shows that the LG G7 ThinQ will be powered by Qualcomm's current high-end mobile chipset, the Snapdragon 845.

This is according to a Geekbench benchmark listing that showcases the suspected G7 ThinQ with model number LGE GM-710. Previous leaks also tease about the smartphone's super bright 1000-nit display.