Although no concrete details have yet been given on when the next flagship outing will be for Motorola, speculations about an upcoming Moto X have already floated online. The latest rumors suggest that Motorola is designing the next version of Moto X to include pipe cooling features.

According to GSM Arena, next year's Moto X could feature a heat pipe among its internals. This is meant as a passive cooling feature, which would optimize the unit's performance by keeping the chipset constantly cooled down.

The report also mentioned that this new feature rumored to be adopted by Motorola for its upcoming flagship isn't new tech. Passive heat pipe cooling has been used before by other tech manufacturers like Microsoft for its Lumia 950 XL, and Sony Mobile for its Xperia Z5 Premium. The industry follower added that the same cooling features were employed to tackle processor overheating, one of the issues that plagued Qualcomm's earlier batches of the Snapdragon 810 chipset.

Meanwhile, aside from keeping the temperature of the internals of the new Moto X down, Pocket Lint suggested that the heat pipe cooling feature may also be connected to another rumored feature of the Moto X 2016. According to the industry follower, the handset may feature overclocking, which means that tech-savvy users can tinker with the unit to make the processor run above its expected maximum performance levels. This in turn tends to heat the chipset. Having a passive cooling feature means that overclocking is a real possibility for the fourth-gen Moto X.

It is also rumored that aside from a heat pipe, Motorola is also thinking of putting a fingerprint scanner on the new Moto X. This feature may well be integrated into the new iteration as fingerprint scanners are becoming the norm in recently released flagships, according to Phone Arena. Meanwhile, other features rumored to come with the Moto X 2016 include an all-metal unibody design and the signature Moto Maker customization option.