Qualcomm's upcoming mobile chipset named the Snapdragon 815 will be manufactured on the 20 nm process, resulting in a powerful and energy efficient chip . The smaller lithographic process does have its advantages when thermal efficiency is taken into account and the latest benchmarking test reveals that the company's upcoming SoC performs much better compared to the Snapdragon 810 and 801.

According to the information posted on Stjsgadgets-portal, a benchmark which recorded each chipset's thermal performance was executed using a taxing mobile gaming application. In order to display the most accurate form of benchmarking reports, four variables remained constant throughout the whole test. Those variables are as follows:

• 5 inch screen size
• 1080p resolution
• 3 GB of RAM
• No cellular antenna

The website states that the reason why no cellular antenna was present during the commencing of the benchmark was because its absence would force the chips to run warmer than their limits, giving the temperature results based on a worst case scenario. Asphalt 8was used to raise the temperatures of each chipset, with the results given below:

• Snapdragon 815: 100.4 degrees Fahrenheit
• Snapdragon 801: 107.6 degrees Fahrenheit
• Snapdragon 810: 111.2 degrees Fahrenheit

Both the Snapdragon 810 and 815 are processed on the same 20 nm manufacturing process and the latter still came out on top when the tests were finished. The surprising thing about these results was that the Snapdragon 801 showed better thermal efficiency compared to its better performing SoC, which gives speculation on whether there is actually a flaw in the company's Snapdragon 810 when temperature control is concerned.

The Snapdragon 815's octa-core processor will be aided by Adreno 450 GPU and it is expected that the first batch of smartphones sporting the chipset will be released during Q4, 2015.