Qualcomm Snapdragon 620 and 615: thermal tests allegedly revealed

 Wikipedia

In addition to releasing its high-end Snapdragon 820 and 815 SoCs later in the year, leading mobile chipset maker Qualcomm will also be releasing its mid-ranged chipsets around the same period. These SoCs, which are known as Snapdragon 620 and 615, have had their thermal benchmarks allegedly tested out by the company. According to Stjsgadgets-portal, both chipsets were tested out in controlled environments, in which the Snapdragon 620 turned out to be the victor.

The controlled variables that were used in order to display the most accurate results on the benchmark are as follows:

  • 4.7 inch IPS display
  • 720p resolution
  • 1.5 GB of RAM
  • No cellular antenna or radio present

Since the chipsets will be incorporated into mid-ranged handsets, it would not be necessary to use higher tier variables to conduct the tests. One of the reasons that a cellular antenna had been omitted from these tests was because it will cause the chipsets to heat up more than usual, thus displaying inaccurate information concerning the thermal efficiency of Qualcomm's products. In order to drive the SoCs to their temperature limits, Mordern Combat 5: Blackout was the mobile gaming application used. The results are as follows:

  • Snapdragon 620: 107.6 degrees Fahrenheit
  • Snapdragon 615: 114.8 degrees Fahrenheit

The better performing chipset was expected to display a higher temperature compared to the Snapdragon 615 due to its higher processor clock speed but Snapdragon 620 was shown to run seven degrees cooler than its lower performing brother. In addition, its 'cool down' performance was thoroughly impressive as the 'system on a chip's thermal levels reduced instantaneously when the test was over.

The same thing could not be said about Snapdragon 615 because it displayed erratic behavior concerning its temperature. While Qualcomm has not stated as to why this took place, it is expected that the company will be making the necessary improvements to its chips before they are assimilated to devices during the Q4, 2015 period.

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